Planar polishing machine for single crystal silicon wafer surface
        So far, the polishing of plane polishing machine is the only one that can achieve the global planar technology and equipment, the method can be used to obtain the entire silicon wafer with ultra smooth and no damage surface. Among them, the quality of the polishing liquid is a key factor to affect the effect of CMP. At present, the spherical SiO2 particles of nm 50~70 are generally used in the silicon wafer CMP. As an effective polishing powder, nano CeO2 has been widely used in the chemical mechanical polishing of SiO2 dielectric layer and the isolation trench, which has the advantages of high polishing efficiency and high surface quality. It is indicated that the polishing efficiency of the spherical nano CeO2 is higher than that of the spherical SiO2.
        However, the research of the nano CeO2 polishing machine is still in the initial stage, the preparation technology and the related polishing mechanism need to be further improved. The rare earth cerium resources in our country are the first in the world, such as the development of nano CeO2 polishing solution which is suitable for the polishing of silicon wafer, will promote the development of ultra precision machining technology, and the social economic benefits are considerable. It can be seen that the rare earth polishing powder plays an important role in the process of the single crystal silicon wafer polishing. Single crystal silicon wafer polishing machine technology in the industry has a very large application prospects, there is a great space for development.
         The plane of the wafer polishing machine Head grinding can make the silicon planar silicon wafer, improve surface smoothness and accuracy. Here is a brief introduction to this kind of silicon wafer polishing machine. .
Effect of silicon wafer plane polishing machine:
         The line in grinding machine is particularly suitable for in metal, crystal mirror effect of single plane grinding and polishing, with the use of the company's research and development configuration of polishing consumables workpiece up to a mirror effect. Finish this up to nanometer level, no data lines, pitting, peel, scratch after polishing, put in the air without oxidation. Can meet the needs of small and medium-sized workpieces were production requirements, but also for mold, not rust steel, ceramic sheet, hard disk, seals and other semiconductor and fund belongs to the material of the mirror grinding and polishing. The machine is strong, for a person with the same material grinding and polishing, processing of different materials it updates only exchange process can, choose the different process according to customers for different materials. There are a variety of different optional machine capacity, customers can according to different requirements to choose corresponding models of production quantity.
        Characteristics of silicon wafer plane polishing machine:
1 with high precision high repair disk device, the grinding plane was up to about 0.002mm.
2 frequency control, soft start, soft stop, impact strength, reduce the damage of the workpiece.
3. Line in grinding machine PLC programming control system, touch screen control panel, the speed of grinding wheel and timing   can be directly on the touch screen input.
4. Polishing liquid automatic spray system, grinds the material can be evenly sprayed on the grinding wheel, processing rate of workpiece in high but also more stable. Can also reduce the grinding time, saving the cost of the supplies has also meet the requirements of environmental protection, taiwan.
5 the use of military bearing, Taiwan originating in the motor, to ensure the stability and life of the equipment, to ensure the high precision of the workpiece.
         Hyde precision grinding not only production wafer surface polishing machine, but also to undertake the silicon wafer polishing, grinding polishing, planar polishing, stainless steel, copper, aluminum, plastic, ceramic, a guide board, hardware products, sapphire, optical glass, and so on. All kinds of polished processing services. Hyde precision grinding has 400 square meters of professional polishing processing zones, dedicated to provide customers with the processing, Hyde has a mature production technology, advanced production equipment, wafer polishing processing, metal polishing is Hyde's business focus on services, processing large quantity, wide range, good quality and good performance. Head would like to take people-oriented, common development "operating principles, dedication to provide precision grinding and polishing processing service for customers.